We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plasma Etching Equipment.
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Plasma Etching Equipment Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Plasma Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 片桐エンジニアリング Kanagawa//Other manufacturing
  2. 三友製作所 テクノセンタ Ibaraki//Industrial Machinery
  3. シナノ精機 Niigata//Manufacturing and processing contract
  4. プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  5. 神港精機 東京支店 Tokyo//Industrial Machinery
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Plasma Etching Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. CCP plasma etching device 'CCP-T60M/B2M' 片桐エンジニアリング
  2. Wire and tube etching device シナノ精機
  3. Sanyu Manufacturing Co., Ltd. Company Profile 三友製作所 テクノセンタ
  4. Notice of Participation in "Semicon Japan 2024" and Seminar Hosting プラズマ・サーモ・ジャパン
  5. Plasma etching device "EXAM" sample testing now accepting applications. 神港精機 東京支店

Plasma Etching Equipment Product List

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Plasma etching device "EXAM" sample testing now accepting applications.

Plasma etching device "EXAM" sample testing now accepting applications.

A compact batch-type plasma etching device that supports sub-micron etching and features process support through sample testing.

Supports etching of submicron Si oxide films in batch type. Compatible not only with SiN and Si-based thin films but also with high melting point metals and difficult-to-etch materials. Ideal for processing niche devices such as vertical etching of quartz and fine processing of thick photoresist. Actively supports a wide range of applications from ashing to cleaning through a multi-step process enabled by plasma mode switching.

  • Etching Equipment
  • Other physicochemical equipment
  • Plasma Generator

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CCP plasma etching device 'CCP-T60M/B2M'

CCP plasma etching device 'CCP-T60M/B2M'

High-precision and high-reliability oxide film microfabrication! Selectively generating radicals from process gases.

The "CCP-T60M/B2M" is a parallel plate etching device that achieves high precision and high reliability in oxide film microfabrication. It selectively generates radicals from process gases and applies 60MHz power to the upper electrode to obtain low electron temperature and high-density plasma. Additionally, it is equipped with a sequence program that constantly maintains appropriate etching process conditions. 【Features】 ■ Parallel plate etching device ■ Achieves high precision and high reliability in oxide film microfabrication ■ Selectively generates radicals from process gases ■ Applies 60MHz power to the upper electrode ■ Equipped with a sequence program *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment

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Wire and tube etching device

Wire and tube etching device

Processing that is stronger than UV treatment but weaker than blasting or polishing is possible. It is suitable for processing elongated workpieces, compact, and has low running costs.

- Can process workpieces with weak mechanical strength - Non-contact treatment that does not damage the workpiece - Does not use liquids - Can process not only metals but also resins - Only Ar gas and water are required for the process - Does not produce dust or waste - Can be installed in clean rooms (excluding vacuum pumps)

  • Other processing machines

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Sanyu Manufacturing Co., Ltd. Company Profile

Sanyu Manufacturing Co., Ltd. Company Profile

With cultivated skills and a new sensibility, we will continue to advance into the new era!

Sanyu Manufacturing Co., Ltd. is a manufacturing company that produces medical analytical instruments, accessories related to electron microscopes, and tools for semiconductor failure analysis. Since its establishment, the company has focused on precision machining, and the technology cultivated there has shaped our technical foundation. By maintaining a consistent production system from design, machining, to assembly and adjustment, we are able to respond to customers' demands for short delivery times. Currently, the majority of our production is related to medical analytical instruments, but in recent years, we have also been engaged in technology development aimed at the next generation. We aim to anticipate our customers' needs and continuously act as challengers, contributing to the advancement of science and the creation of the future. 【Business Activities】 ■ Manufacturing of accessories related to electron microscopes ■ Manufacturing of semiconductor failure analysis tools ■ Precision machining ■ Manufacturing of analytical instrument-related products *For more details, please download the PDF or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Contract manufacturing

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Multi-Purpose Etching and Coating Solutions

Multi-Purpose Etching and Coating Solutions

Etching and film deposition for a wide range of markets, including fault analysis, MEMS, optical MEMS, and advanced packaging, are possible!

The "Shuttleline200 Series" is a flexible and multipurpose platform for etching and PECVD applications. By adopting a unique shuttle concept, it enables handling of samples in various sizes, from small pieces to full wafers, providing a multipurpose etching and deposition solution. It also allows for plasma processing technologies such as RIE, ICP, PECVD, and ICP-CVD, offering suitable processing for R&D applications and small-scale production. Specifically, it can perform etching and deposition for a wide range of markets, including failure analysis, MEMS, optical MEMS, advanced packaging, and processes for power semiconductors. 【Features】 ■ Easily adaptable to a wide variety of substrate shapes and sizes due to the unique shuttle concept. ■ User-friendly equipment with a wealth of options and high upgradeability. ■ Multipurpose capability to meet advanced and specific requirements such as RIE and ICP etching. *For more details, please feel free to contact us.

  • others

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Notice of Participation in "Semicon Japan 2024" and Seminar Hosting

Notice of Participation in "Semicon Japan 2024" and Seminar Hosting

At the seminar, we plan to introduce new technologies such as HDRF-high-density radicals for low-temperature removal of polymers and HDI resists.

Plasma Thermo Japan Co., Ltd. will be exhibiting at "Semicon Japan 2024" held at Tokyo Big Sight. Our company specializes in plasma technology, handling etching, deposition, cleaning equipment, ALD-like deposition equipment, ion beam equipment, PVD equipment, and RTP equipment. We also offer batch-type sputtering equipment and electron beam evaporation equipment, enabling us to propose solutions for various applications. In the seminar held at our booth, we plan to introduce new technologies that enable low-temperature removal of polymers and HDI resist using HDRF-high-density radicals, as well as new technologies for ALD-like deposition with the deposition rate of KBOUS FAST-CVD. We look forward to your visit. 【Event Overview】 ■ Dates: December 11 (Wed) - 13 (Fri), 2024, 10:00 - 17:00 ■ Venue: Tokyo Big Sight, East Hall 4, Booth 4032 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line, Kokusai-Tenjijo Station (approximately 7 minutes on foot) - Yurikamome, Tokyo Big Sight Station (approximately 3 minutes on foot) *For more details, please refer to the related links or feel free to contact us.

  • Etching Equipment

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MEMS Engineer Forum - Notice of Technical Exhibition

MEMS Engineer Forum - Notice of Technical Exhibition

Improving the precision and efficiency of MEMS processing! We will introduce high-precision etching and film deposition technologies. *Held from April 16 to April 17.

Plasma Thermo Japan Co., Ltd. will exhibit at the technical exhibition corner of the "MEMS Engineer Forum 2025" held at the International Fashion Center Building (KFC Hall) in Ryogoku, Tokyo. <Exhibition Contents> 1. Low-temperature, low-damage etching and cleaning equipment using high-density radicals The patented HDRF technology (High Density Radical Flux) eliminates the causes of yield reduction in MEMS. 2. Processing technology essential for future high-frequency devices and high-speed optical modulation waveguide processing (Ion Beam Etching) Ion beam etching suitable for processing multilayer structures. The tilt mechanism of the wafer stage allows for adjustment of side wall angles. 3. Plasma etching and film deposition equipment suitable for batch processing of compound semiconductors Multiple wafers can be loaded onto a "shuttle" (wafer carrier) for batch processing. This equipment is suitable for small-scale production. We sincerely look forward to your visit. *You can download the equipment catalog. *Please feel free to contact us for more details.

  • Etching Equipment

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